Liquid metals are being used in the CPU Heat dissipation of high-performance gaming PCs. Achieving high speed and stable application with non-contact Jet dispense.
A thermal management solution that supports new technologies such as next-generation power semiconductors, 5G, and IoT.
It is fast, there is no contact accident with the workpiece, and can be applied from lower, horizontal, or diagonally.
A conformal coating that protects the mounting board (PCB).
There is no problem even if there is a different distortion or warpage in each workpiece, or if the workpiece is shifted in the pallet.
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