Adhesive/Joining EXPO Exhibition

Category
Exhibition 
Tag

Musashi Engineering, Inc.

B!
Adhesive/Joining EXPO Exhibition

Date and time         : From November 12 (Wed) to November 14 (Fri), 2025 10:00 to 18:00 (only the last day ends at 17:00)
Place                  : Makuhari Messe
Room position         : 7 Halls 41-6
Exhibition Site: Here

・Main Exhibited Products
  1. Solder paste jet dispenser "HYPERSOLDERJETR"
  2. Fully automatic high productivity dispensing machine "FAD2500W"
  3. Ultra-high-speed and Non-contact JET dispenser SuperJet 3
  4. Automation of liquid and powder blending process 

    In Other, we will exhibit a number of products suitable for various liquid materials for electronic components Industry, from R&D to manufacturing.
  By all means, please drop in at our booth and consult us about anything such as application testing and customization.

In addition, we will participate in the seminar on the following schedule during the exhibition.
Exhibitor Presentation
 ※Pre-registration is not required.
 ・Date and time of seminar
   Friday, November 14, 2025 13:30 to 14:15
 ・Seminar Place
   Next Tech STAGE ~New Technology introduction by Exhibitors~Seminar B Venue
 ・Summary
   “Changes in dispensing technology brought about by
diversifying liquid materials” 
     Liquid materials are increasing their types every day. Depending on the characteristics of the newly emerging liquid material,
           I would like to introduce what kind of technology is required in Dispenser.


・About your visit
Pre-registration is required   for visitors, so please be careful not to forget it.

 We look forward to your visit.