Post-PCB Assembly Dispensing Solutions

In recent years, the surface mount technology (SMT) industry has been facing demands for environmental compliance and improved production efficiency amidst trends toward higher density and higher performance driven by technological innovations such as 5G, IoT, and autonomous driving.
MUSASHI's product lineup is utilized in many processes within the assembly stage, including the precision application of adhesives and solder paste, thanks to our extensive range of dispensers. We not only achieve improved productivity and stable quality but also contribute to cost reduction and a lower environmental impact by minimizing material waste.

Surface Mount Process

Printed Circuit Board

Printing

Print solder paste onto the board using a metal mask.

Mounting

Mount chip components in their designated positions.

Reflow

Use a reflow oven to heat and melt the solder paste on the board, fixing the components in place.

Assembly Process

Plasma treatment

Improve adhesion and bonding by removing organic substances from the surface and through chemical activation.

Component reinforcement/moisture proofing

Component reinforcement

Reinforcing mounted components increases resistance to external shocks and stress, reducing the risk of component detachment and crack formation at solder joints.

Encapsulation/Moisture-proofing

Coating the circuit board protects the surfaces of the board and components, ensuring high reliability even in harsh environments such as outdoors.

Heat dissipation

Enables efficient heat dissipation.

Assembly

Manufactures finished products by combining with other components and cases. Assembles them into a form that functions as a final product or module.

Complete!

List of Proposed Products

Number

Applications

Product name

1

Solder paste supply to desktop printers

Full-featured digital control dispenser with high-end model capabilities

ML-8000X

Improved work efficiency

Reduction of liquid material costs

Full-function digital control dispenser ML-8000X

2

Application of temporary fixing agent before mounting

Application of pre-mounting adhesive

Medium to high viscosity non-contact jet dispenser Aero JET

Fully automatic dispenser machine FAD 2500SD

Support for higher density

Faster dispensing

Medium/high viscosity non-contact jet dispenser Aero JET / Fully automatic dispenser machine FAD 2500SD

3

Laser soldering

Laser soldering desktop dispensing system
DISPENSE LASER MASTER

Post-assembly of low heat-resistant components

Quality Improvement

Laser soldering desktop dispensing system DISPENSE LASER MASTER

4

Surface modification plasma treatment

Plasma treatment robot

Quality Improvement

Atmospheric pressure plasma

5

Silicone application to the base of
capacitors

High-performance screw dispenser
SCREW MASTER 3-HF

Support for tall components

Faster dispensing

High-performance screw dispenser SCREW MASTER 3-HF

6

BGA underfill
/sidefill

Fully automatic dispensing machine
FAD 2500SD

Yield improvement

Faster dispensing

Fully automatic dispensing machine FAD 2500SD

7

Silicone encapsulation of sensor components

Silicone sealing of
sensor components

Ultra-lightweight non-contact jet dispenser
SuperJet 3i Hi POWER

Yield improvement

Faster dispensing

Ultra-micro, non-contact jet dispenser SuperJet3 Hi POWER

8

Conformal
coating

Fully automatic dispensing and coating machine
FCD1200

Quality Improvement

Support for large substrates

Fully automatic conformal coating machine FCD1200

9

Thermal
gap filler application

2-component thermal interface material dispensing system for pail cans
MPP-GF-HF + LPP-1

Quality Improvement

Reduction of running costs

Two-component thermal material application system for pail cans MPP-GF-HF + LPP-1

10

Resin sealing after
PCB assembly

Volumetric digital control dispenser
MEASURING MASTER MPP-5 SERIES

Automated weighing and mixing

Yield improvement

Volumetric digital control dispenser MEASURING MASTER MPP-5 SERIES

11

Fixing PCB to case
(screw tightening)

Screw tightening robot

High aspect ratio

Bubble-free

12

Liquid gasket application

High-performance Mohno-type dispenser
MOHNOMASTER SERIES

Easy programming

Poka-yoke (error-proofing) support

High-performance Mohno dispenser MOHNOMASTER SERIES

Dispensing SolutionsPost-PCB Assembly Process

List of Proposed Products

Dispensing Solutions
Post-PCB Assembly Process