The adoption of liquid metals is progressing in CPU Heat dissipation, a high-performance gaming PC. High-speed and stable application with contactless Jet dispense.
A thermal management solution that supports new technologies such as next-generation power semiconductors, 5G, and IoT.
Fast speed, no contact accident with workpieces, can be applied from lower, horizontal, and diagonally.
A conformal coating to protect mounting substrates (PCBs).
There is no problem even if the workpiece has different distortions or warpages, or if the workpiece is misplaced in the palette.
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