
We propose semi-automation for filling chemical liquids into screw cap tubes, conical tubes, and vials, as well as for capping and decapping operations.
Liquid metal is increasingly being used for CPU heat dissipation in high-performance gaming PCs. Non-contact jet dispensing enables high-speed, stable application.
Thermal management solutions supporting new technologies such as next-generation power semiconductors, 5G, and IoT.
High speed, no contact accidents with workpieces, and capable of coating from below, the side, or at an angle.
Conformal coating to protect printed circuit boards (PCBs).
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