Proposes semi-automation of the filling of screw-cap tubes, conical tubes and vials with chemicals and cap opening and closing operations.
Liquid metal is increasingly used for CPU heat dissipation in high-performance gaming PCs. High speed and stable dispensing with non-contact jetting is realized.
Thermal management solutions to support new technologies such as next generation of Power semiconductors, 5G, and IoT.
Jetting valve can shoot a material from below, side and angled positions, with high throughput and ensure no collision with products.
Conformal coating that protects Printed circuit boards (PCB) from moisture.
In order to download materials, you must first register to log into this site.
Click here to download materials if you have already registered to log in.
If you have not registered to log in, click here to register and then you can download materials.