
Proposing semi-automation for chemical filling and cap opening/closing for screw-cap tubes, conical tubes, and vials.
Liquid metal is increasingly being adopted for CPU heat dissipation in high-performance gaming PCs. Non-contact jet dispensing enables high-speed, stable application.
Thermal management solutions supporting new technologies such as next-generation power semiconductors, 5G, and IoT.
Conformal coating to protect printed circuit boards (PCBs).
No issues even if individual workpieces have different distortions or warpage, or if the workpieces are misaligned within the pallet.
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