
We propose semi-automation for filling chemical liquids into screw cap tubes, conical tubes, and vials, as well as for capping and decapping operations.
Liquid metal is increasingly being used for CPU heat dissipation in high-performance gaming PCs. Non-contact jet dispensing enables high-speed, stable application.
Thermal management solutions supporting new technologies such as next-generation power semiconductors, 5G, and IoT.
Conformal coating to protect printed circuit boards (PCBs).
No issues even if individual workpieces have different distortions or warpage, or if the workpieces are misaligned within the pallet.
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