Thermal management solutions to support new technologies such as next generation of Power semiconductors, 5G, and IoT
case studuies
Dispensing of One/Two-part Thermal management materials
Issues
- Although a cavity pump is applied to a dispensing process of 2-part GAP FILLER,
the cost of consumable parts is expensive because the rotor and the stator has to be exchanged every 2months. - Moreover, dispensing accuracy of the volume lower than 1g/shot is bad, making it difficult to achieve stable dispensing.
- Not easy to choose the suitable dispenser for high viscous One-part thermal management materials such as the viscosity higher than 8,000,000mPa.
Actions
- Changed from a cavity pump to a plunger pump specialized for GAP FILLER.
- Screw dispenser was proposed for high viscous one-part thermal management materials.
Results
- The change to a plunger pump with fewer consumable parts has reduced the maintenance cycle by 1/3, from 2 months to 6 months.
- The plunger pump achieved quantitative application even at 0,5g/shot.
- For high vicous one-type thermal management materials, we proposed a screw dispenser and achieved the dispensing requirements.
PROPOSED PRODUCTS
Solution Products
OTHER CASES
Other Case Studies
Proposes semi-automation of the filling of screw-cap tubes, conical tubes and vials with chemicals and cap opening and closing operations.
Liquid metal is increasingly used for CPU heat dissipation in high-performance gaming PCs. High speed and stable dispensing with non-contact jetting is realized.
Jetting valve can shoot a material from below, side and angled positions, with high throughput and ensure no collision with products.
Conformal coating that protects Printed circuit boards (PCB) from moisture.
No problem even if individual workpieces have different distortion or warping, or workpieces are misaligned in the pallet.
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