Liquid metal is increasingly being adopted for CPU heat dissipation in high-performance gaming PCs.
Case study Liquid metal application
Challenges
- With valve systems or brush application, it is difficult to apply liquid metal with high surface tension to a surface, and it is impossible to create a uniform film.
- We want to change the thickness for each product type, but adjustment is difficult.
- We are looking for a method to seal liquid metal.
Solutions
- Introduced a non-contact dispenser.
- Formed a dam by applying sealant in a line.
Results
- Non-contact dispensing stabilized the application shape. (Refer to the left side of the video above)
- It became possible to change the film thickness by changing the Jet dispenser parameters.
- Achieved sealing of liquid metal by forming a dam. (Refer to the right side of the video above)
PROPOSED PRODUCTS Proposed Products
OTHER CASES
Other Case Studies
We propose semi-automation for filling chemical liquids into screw cap tubes, conical tubes, and vials, as well as for capping and decapping operations.
Thermal management solutions supporting new technologies such as next-generation power semiconductors, 5G, and IoT.
High speed, no contact accidents with workpieces, and capable of coating from below, the side, or at an angle.
Conformal coating to protect printed circuit boards (PCBs).
No issues even if individual workpieces have different distortions or warpage, or if the workpieces are misaligned within the pallet.
Download Catalogs and Software
Login registration to this site is required for downloads.
Contact Us