The use of liquid metals in the CPU Heat dissipation, a high-performance gaming PC.
Cases Jetting of liquid metal
Issues
- With the valve method or brush coating, it is difficult to apply a liquid metal with high surface tension to a substrate, making it impossible to create a uniform coating thickness.
- Wanting to change the thickness of liquid metal, depending on products, although adjusting is difficult.
- Looking for a method to seal the liquid metal.
Actions
- Introduction of Jetting valve
- Proposing to make a dam with a sealant.
Results
- Non-contact dispensing stabilized the coating shape. (Refer to the video of below left side)
- Coating thickness can now be changed by changing the parameters of Jet dispenser.
- Sealing of Liquid metal with the dam is realized. (Refer to the video of below right side)
PROPOSED PRODUCTS Solution Products
OTHER CASES
Other Case Studies
Proposes semi-automation of the filling of screw-cap tubes, conical tubes and vials with chemicals and cap opening and closing operations.
Thermal management solutions to support new technologies such as next generation of Power semiconductors, 5G, and IoT.
Jetting valve can shoot a material from below, side and angled positions, with high throughput and ensure no collision with products.
Conformal coating that protects Printed circuit boards (PCB) from moisture.
No problem even if individual workpieces have different distortion or warping, or workpieces are misaligned in the pallet.
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