The adoption of liquid metal is progressing in CPU Heat dissipation of high-performance gaming PC
Case study Jetting of liquid metal
Challenges
- It is difficult to apply liquid metals with high surface tension in the valve system or brush coating, and it is not possible to create a uniform deposition.
- I want to change the thickness of each breed, but it is difficult to adjust.
- We are looking for a method of sealing liquid metals.
Measures
- Introduction of contactless Dispenser.
- Dam formation is carried out by applying Line dispensing sealant.
Effect
- With non-contact dispensing, the application shape is stable. (Refer to the left side of the video above)
- By changing the parameters of Jet Dispenser, the film thickness can be changed.
- By dam formation, liquid metal sealing is realized. (Refer to the right side of the video above)
PROPOSED PRODUCTS Proposed Products
OTHER CASES
Other Case Study
Filling chemical solution for screw cap tubes, conical tubes and vial bottles, and semi-automated cap opening and closing operations.
A thermal management solution that supports new technologies such as next-generation power semiconductors, 5G, and IoT.
Fast speed, no contact accident with workpieces, can be applied from lower, horizontal, and diagonally.
A conformal coating to protect mounting substrates (PCBs).
There is no problem even if the workpiece has different distortions or warpages, or if the workpiece is misplaced in the palette.
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