Adhesive & Bonding EXPO Osaka Exhibition
Date and time ： May 14 (Wednesday) to May 16 (Friday), 2025 10:00～17:00
Place ： Intex Osaka
Room position ： Building No. 4 19-42
Exhibition Site: Here
・Main Exhibited Products
1. Ultra-micro, contactless jet Dispenser HyperJet2
2. Fully automatic high productivity dispensing machine "FAD2500W"
3. Full-function Digital Control Dispenser Super ΣCMIV
Other will also exhibit a large number of new products, including electronic components from R&D to manufacturing, and products suitable for various liquid materials for the automotive industry.
By all means, please drop in at our booth and consult us about anything such as application testing and customization.
In addition, we will participate in the seminar on the following schedule during the exhibition.
「Next Tech STAGE exhibitor introduces new technologies」
※In addition to the pre-registration of the exhibition, you will need to apply on the above page.
※On the above page, select "New Technology Presentation Seminar by Exhibitors" and "May 16th" to display our seminar information.
・Date and time of seminar
Friday, May 16, 2025 13:30 to 14:15
・Seminar Place
Next Tech Stage Seminar Venue: INTEX Osaka Building 5
・Summary
Dispense technology and liquid materials related to the SDGs
Pre-registration is required for visitors, so please be careful not to forget it.
We look forward to your visit.
