Notice of Exhibition at Bonding & Joining EXPO
Date & Time : September 30 (Wed) – October 2 (Fri), 2026, 10:00–18:00 (Ends at 17:00 on the final day only)
Venue : Makuhari Messe
Booth Location : Hall 6, 36-6
Exhibition Website: Click here
・Main Products on Display
1. Solder Paste Jet Dispenser " HYPER SOLDERJETⓇ "
2. Fully Automatic High-End Dispensing Machine " FAD5700 "
3. Full-Function Digital Control Dispenser " SuperΣCMⅣ Pro "
4. Ultra-High-Speed Non-Contact Jet Dispenser "SuperJet3 Hi POWER"
We will also be exhibiting many other products, including new releases, suitable for various liquid materials ranging from research and development to manufacturing.
Please feel free to stop by our booth to discuss anything, including dispensing tests and customization.
・Regarding Attendance
Please note that advance registration is required for attendance, so please do not forget to register.
We will also be holding a seminar during the event on the following date:
"Exhibitor Presentation"
・Seminar Date & Time
October 2, 2026 (Fri) 13:30–14:15
・Seminar Venue
Hall 7, Next Tech STAGE Seminar Venue B
・Abstract
"Changes in Dispensing Technology Driven by Diversifying Liquid Materials"
The variety of liquid materials is increasing day by day.
We will introduce what kind of technology is required for dispensers in response to the characteristics of newly emerging liquid materials.
We look forward to seeing you there.
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