Minimum Application Diameter by Solder Paste Type
| Type | Type 5 | Type 6 | Type 7 | Type 8 |
|---|---|---|---|---|
| Minimum Dot Diameter | 250μm | 150μm | 110μm | 100μm |
Solder Paste Type 8
φ100μm 1 Million Shots
- Ave. 87μm
- Max. 94μm
- Min. 77μm
- 3σ 7.8μm
Overview
The application of solder paste using non-contact dispensers is increasingly in demand across various fields, including automotive circuit boards, as a technology capable of selectively applying solder paste to required areas at high tact times. On the other hand, solder paste is a functional material containing fillers such as solder alloy powder, and slight changes in powder particle size or distribution can affect fluidity and cause nozzle clogging. Therefore, it is not easy to perform stable continuous application over a long period of time while maintaining an ultra-micro size.
Musashi Engineering is developing non-contact application technology that achieves both ultra-micro application and continuous stability to address this challenge.
Achieves stable non-contact dispensing of solder paste for over 1 million continuous shots
Musashi Engineering has developed a technology for the continuous stable application of solder paste using non-contact application, achieving over 1 million shots of continuous stable application for solder pastes from Type 5 to Type 8. Furthermore, regarding application diameter, we have achieved stable application of over 1 million shots with micro-diameters of φ250μm for Type 5 and φ100μm for Type 8. This technology enables solder bonding to finer components, contributing to the miniaturization of devices.
OTHER CASES
Other Case Studies
By thoroughly optimizing the structure and conditions to match the discharge properties of the Ag paste, we have achieved a dispensing diameter of 31μm and a dispensing volume of 5pL.
Conductive paste can be routed from the substrate, via the side of the chip, to the conductive part on the top surface of the chip.
With this technology, we have achieved the formation of micro-dots with a minimum diameter of φ64μm and thin films with a thickness of 19μm.
We have successfully performed underfill (UF) agent application while limiting the wetting spread from the chip edge to a minimum of 150μm.
We performed underfill (UF) application under extremely narrow conditions with a chip gap of 100µm and a standoff of 50µm.
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