KOZ underfill (UF) agent dispensing technology for 150μm or less
Overview
In both primary underfill (UF) for flip-chip mounting and secondary underfill (UF) for package mounting, high-density mounting is accelerating along with the miniaturization of products. Consequently, the importance of "narrow KOZ (Keep Out Zone) support technology," which enables stable dispensing while suppressing wetting spread from the chip edge even when there are adjacent areas where underfill (UF) material must not adhere, is increasing.
Musashi Engineering has developed an underfill (UF) dispensing technology that achieves a KOZ of 150μm or less to address this challenge.
Underfill (UF) dispensing with wetting spread suppressed to a minimum of 150μm
We performed underfill (UF) dispensing that actually suppressed wetting spread from the chip edge. Observation from the top confirms that the wetting spread from the edge is suppressed to 150μm.
OTHER CASES
Other Case Studies
By thoroughly optimizing the structure and conditions to match the discharge properties of the Ag paste, we have achieved a dispensing diameter of 31μm and a dispensing volume of 5pL.
Conductive paste can be routed from the substrate, via the side of the chip, to the conductive part on the top surface of the chip.
We have achieved continuous stable dispensing of over 1 million shots for solder pastes from Type 5 to Type 8.
With this technology, we have achieved the formation of micro-dots with a minimum diameter of φ64μm and thin films with a thickness of 19μm.
We performed underfill (UF) application under extremely narrow conditions with a chip gap of 100µm and a standoff of 50µm.
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